Financial Assistance for Students at GIA Campuses Outside the U.S.

While Federal financial aid is not available for non-U.S. citizens when attending a GIA campus within or outside the U.S., GIA-administered scholarships are available for select International locations for non-U.S. citizens living outside the U.S.

GIA now offers scholarships during two application periods each year for its Gemology and Jewelry Manufacturing Arts programs, courses, and Lab classes – March 1 through April 30 and June 15 through October 30.

GIA Scholarship - International Distance Education eLearning Courses
Award maximum: US $1,500
Scholarships available to be applied toward any of the five Distance Education eLearning core gemology courses required for the Graduate Gemologist (GG) diploma. Does not include Lab classes. Applicants must be non-U.S. citizens living outside the U.S. Courses available in English only.

Hong Kong

Hong Kong scholarship information

GIA Scholarship - Hong Kong
Award maximum: US $ - Varies
Two scholarships available for the on campus Diamond Program at GIA’s Hong Kong campus. Applicants must be non-U.S. citizens whose country of residence is outside the U.S.

Middle East (Dubai)

Middle East scholarship information

GIA Scholarship - Middle East
Award maximum: US $ - Varies
Scholarships available for any on campus program at GIA’s Middle East branch located in Dubai. Applicants must be non-U.S. citizens whose country of residence is outside the U.S.

Taiwan (Taipei)

Taiwan scholarship information

GIA Scholarship – Taiwan
Award maximum: US $ - Varies
Scholarships available for any on campus program at GIA’s Taiwan campus. Applicants must be non-U.S. citizens whose country of residence is outside the U.S. Instruction is available in Chinese only.

U.K. (London)

U.K. scholarship information

GIA Scholarship - London
Award maximum: US $ - Varies
One scholarship available for any on campus lab classes at GIA’s London campus. Applicants must be non-U.S. citizens whose country of residence is outside the U.S.